| 摘要 |
PURPOSE: A light emitting device and a manufacturing method thereof and a light emitting device package are provided to reduce light loss with a new structure. CONSTITUTION: A light emitting structure comprises a first conductive semiconductor layer(130), the active layer(140) formed on the first conductive semiconductor layer, the second conductive semiconductor layer(150) formed on the active layer, the super lattice structure layer(160) formed on the second conductive semiconductor layer, and the third conductive semiconductor layer(170) formed on the super lattice structure layer. A light transmissive electrode layer(190) is formed on the light emitting structure. A first electrode(180) is connected to the first conductive semiconductor layer. A second electrode(195) is electrically connected to the light transmissive electrode layer on the light emitting structure. An insulating layer(120) is extended from the lower part of a second electrode to the top of the second conductive semiconductor layer. |
