发明名称 PRINTED CIRCUIT BOARD STRIP, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board (PCB) strip and a method of manufacturing an electronic component embedded PCB. <P>SOLUTION: The PCB strip includes a unit area in which a plurality of substrate units are provided, and a dummy area which is provided on an outer side of the unit area, wherein an electronic component is embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge is embedded in the dummy area. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011151341(A) 申请公布日期 2011.08.04
申请号 JP20100132022 申请日期 2010.06.09
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM MOON-IL;CHUNG YUL-KYO;PARK HWA-SUN
分类号 H05K1/02;H01L23/12;H05K3/00;H05K3/46 主分类号 H05K1/02
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