ELECTRON BEAM CURING CONDUCTIVE PASTE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING THE CONDUCTIVE PASTE

摘要

PROBLEM TO BE SOLVED: To provide an electron beam curing conductive paste capable of forming a conductive layer which is excellent in hardness and bendability and also excellent in adhesion to a plastic substrate even if used under high temperature environment, and also to provide a method of manufacturing a circuit board using the conductive paste.

SOLUTION: The conductive paste contains conductive powders, a radically polymerizable composition, and a plasticizer, and the plasticizer is blended in an amount of 5-20 pts.mass based on 100 pts.mass radically polymerizable composition.

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