| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the accuracy of the evaluation of solder wettability of an electronic device. <P>SOLUTION: The evaluation method can stabilize the measurement by reducing scattering in time measurements by observing the actual solder wetting of solder paste 14 by a video camera in the condition that the solder paste 14 is applied to a terminal 6b of a substrate 6 for evaluation and an outer lead 2b of an electronic device is mounted on the solder paste 14, and by defining the starting point and end point of the time measurement of the solder wetting. Also, the accuracy of the evaluation of the solder wettability can be increased. Further, after taking the moving image by the video camera, the wetting time can be measured by frame by frame playback, and thereby detailed time measurement can be performed. <P>COPYRIGHT: (C)2011,JPO&INPIT |
