发明名称 |
Apparatus with a Wire Bond and Method of Forming the Same |
摘要 |
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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申请公布号 |
US2011186334(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
US201113030684 |
申请日期 |
2011.02.18 |
申请人 |
SEMBLANT GLOBAL LIMITED |
发明人 |
HUMPHRIES MARK ROBSON;FERDINANDI FRANK;SMITH RODNEY EDWARD |
分类号 |
H05K1/00;B23K1/20;B23K20/24;B23K31/02;B82Y40/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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