发明名称 |
PASSIVE THERMAL IMPEDANCE MATCHING USING COMMON MATERIALS |
摘要 |
A device and method for dissipating heat from a source of heat is described. A plurality of layers of thermally conductive materials receives a flow of heat from a source of heat. A first layer of the plurality of layers receives the flow of heat from the source of heat and redirects and transfers the flow of heat to a second of the plurality of layers. Each layer has a separate preselected thermal impedance to control a desired temperature change across the plurality of layers and to maintain a desired operating temperature of the source heat. |
申请公布号 |
CA2825668(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
CA20112825668 |
申请日期 |
2011.01.26 |
申请人 |
ROBERTSON TRANSFORMER CO. |
发明人 |
BEASLEY, DENNY D. |
分类号 |
F21V29/00;F28F3/00;H05K7/20 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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