发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition capable of attaining a peeling off property in water in a short time when cooled water of 30°C or lower is used. SOLUTION: The resin composition contains N, N-diethylacrylamide (A) and a photopolymerization initiator (B). A cured article of the resin composition has water-solubility. A temporary fixation method for a workpiece is characterized in that the workpiece is temporarily fixed using the resin composition and after the temporarily fixed workpiece is processed, it is immersed in water to remove the cured article of the composition. The temporary fixation method is characterized in that water is cooled water of 30°C or lower. The surface protection method for the workpiece is characterized in that after the surface of the workpiece is covered by the resin composition and it is cured, the workpiece is immersed in water after processing to remove the cured article of the composition. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011148842(A) 申请公布日期 2011.08.04
申请号 JP20080125319 申请日期 2008.05.12
申请人 DENKI KAGAKU KOGYO KK 发明人 NAKAJIMA GOSUKE;KURIMURA HIROYUKI;OSHIMA KAZUHIRO
分类号 C08F20/56;C08F4/00;C09J4/02;C09J5/00;C09J11/06;C09J133/24 主分类号 C08F20/56
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