METHOD AND APPARATUS FOR PATTERN COLLAPSE FREE WET PROCESSING OF SEMICONDUCTOR DEVICES
摘要
A method is provided for processing a wafer used in fabricating semiconductor devices. The method can comprise forming high-aspect ratio features on the wafer, which is followed by wet processing and drying. During drying, pattern collapse can occur. This pattern collapse can be repaired to allow for additional processing of the wafer. In some instance, pattern collapse can be repaired via etching where the etching breaks bonds that can have formed during pattern collapse.
申请公布号
WO2011094038(A2)
申请公布日期
2011.08.04
申请号
WO2011US20283
申请日期
2011.01.05
申请人
LAM RESEARCH CORPORATION;MIKHAYLICHENKO, KATRINA;SYOMIN, DENIS;FU, QIAN;GALE, GLENN W.;LIU, SHENJIAN;WILCOXSON, MARK H.
发明人
MIKHAYLICHENKO, KATRINA;SYOMIN, DENIS;FU, QIAN;GALE, GLENN W.;LIU, SHENJIAN;WILCOXSON, MARK H.