发明名称 MANUFACTURING METHOD OF INSULATING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To propose a method of manufacturing an insulating substrate for wiring which can be accurately manufactured, in a relatively simple and inexpensive manner. <P>SOLUTION: During an assembly process A, a plurality of metal wires 11 cut in a predetermined length are vertically kept on a glass plate, and a glass 13 as an insulating material cut into a predetermined shape is provided in contact with a base tool 14 of a predetermined shape. During a heating process B, an assembled body is passed through a heating furnace, and the metal wires 11 are pressurized and buried into the softened glass 13; the pressing method includes a step of bringing a weight tool 15 in contact with the plurality of metal wires 11 vertically kept, and pressing them with gravity; the united plate having the metal wires 11 planted on the glass 13 is disassembled into respective tools during a disassembly process C after slow cooling to have the united plate 17 separated; and then the metal wires 11 are cut during a polishing process D, and a glass surface is polished to expose its end surface on the surface of the united plate 17. During a finishing process E, the united plate 17 is subjected to polishing and cleaning to be formed into the insulating substrate 10. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011151414(A) 申请公布日期 2011.08.04
申请号 JP20110091773 申请日期 2011.04.18
申请人 NEC SCHOTT COMPONENTS CORP;SANTEKKU:KK 发明人 KAMATA HIROSHI;ANZAI MASAMI
分类号 H01L23/14;C03B33/02;H01L23/12;H01L23/15 主分类号 H01L23/14
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