发明名称 CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit module which has a shield for preventing interference between electronic components and can be made short. SOLUTION: The circuit module 1 includes: a printed board 10 where an electronic component 11 is mounted; a plurality of conductive chip components 12 fitted to the ground pattern 10g of the printed board 10; a resin sealing member 20 formed so as to cover the electronic component 11 mounted on the printed board 10 and the conductive chip components 12, and having through-holes 21, connecting an upper surface and the conductive chip components 12 to each other, formed in a thickness direction; and a shield layer 30 formed of conductive paste filled in the external surface of the resin sealing member 20 and charged in the through-holes 21. The interval X of two adjacent through-holes 21 is set to 1/2 or 1/4 times as large as the wavelength of a signal to be intercepted. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011151274(A) 申请公布日期 2011.08.04
申请号 JP20100012554 申请日期 2010.01.22
申请人 MURATA MFG CO LTD 发明人 TSUBONO MASANORI;OGATA HIROSHI
分类号 H01L23/28;H01L21/56;H01L25/04;H01L25/18 主分类号 H01L23/28
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