| 摘要 |
Disclosed is an LED package which is provided with: first and second lead frames, which are disposed on the same plane, and are separated from each other; an LED chip, which is provided above the first and the second lead frames, has one terminal connected to the first lead frame, and the other terminal connected to the second lead frame; and a resin body. The resin body covers the LED chip, and also a part of the upper, lower, and end surfaces of respective first and second lead frames, and exposes the rest of the lower surface and the rest of the end surface. |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA;SHIMIZU, SATOSHI;IWASHITA, KAZUHISA;TAKEUCHI, TERUO;KOMATSU, TETSURO;OSHIO, HIROAKI;TONEDACHI, TATSUO;USHIYAMA, NAOYA;INOUE, KAZUHIRO;WATARI, GEN |
发明人 |
SHIMIZU, SATOSHI;IWASHITA, KAZUHISA;TAKEUCHI, TERUO;KOMATSU, TETSURO;OSHIO, HIROAKI;TONEDACHI, TATSUO;USHIYAMA, NAOYA;INOUE, KAZUHIRO;WATARI, GEN |
