| 摘要 |
PURPOSE: An electronic component molding apparatus and a molding method are provided to prevent an imprinted phenomenon by covering a cavity after transferring a middle plate to the lower part. CONSTITUTION: A female mold(100) has a cavity(110) in which resin is provided. A mold(200) is arranged on the top of the female mold and has a lower surface in which an electronic component molded with the resin is attached. A pair of rollers(310,320) is arranged in either sides of the mold and the female mold in order to supply a release film(20) to the interval of the mold and the female mold. A middle plate(400) is arranged in the lower part of the release film around the female mold and has a vacuum hole for vacuum-absorbing the release film to the top. A transport mechanism(500) transfers the middle plate so that the release film adsorbed in the middle plate covers up the top of the cavity.
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