发明名称 |
Semiconductor device, electronic device, and method of producing semiconductor device |
摘要 |
A semiconductor device includes a first insulating film that includes a first opening reaching a substrate and that is provided on the substrate, a second insulating film that includes a second opening reaching the substrate through the first opening of the first insulating film and that covers the first insulating film, and a conductive pattern that is provided on the second insulating film so as to be in contact with the substrate through the second opening of the second insulating film.
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申请公布号 |
US7989955(B2) |
申请公布日期 |
2011.08.02 |
申请号 |
US20080108718 |
申请日期 |
2008.04.24 |
申请人 |
SONY CORPORATION |
发明人 |
YAGI IWAO |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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