| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a mechanical load of a substrate by providing a heat dissipation structure for both CCD (Charge Coupled Device) heat dissipation and substrate heat dissipation. <P>SOLUTION: A heat dissipation structure of a 3-CCD compact camera includes a first route and a second route. In the first route, heat generated from CCDs is dissipated through a CCD fixing plate, a support A and a heat conduction member A to a front frame. In the second route, heat generated from a component on a substrate, whereon the CCDs are mounted, is dissipated through a substrate heat sink and a heat conduction member B to the front frame. Consequently, heat generated from the CCDs and from a heating component can be efficiently dissipated through separate routes, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT |
