| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a current lead easily manufactured and miniaturized while reducing the amount of heat intrusion. <P>SOLUTION: A composite substrate formed with an intermediate layer on an oriented Ni-W substrate having a predetermined area is coated thereon with a YBCO oxide superconductive layer and a stabilizing layer by a TFA-MOD method to prepare an oxide superconductor, and the oxide superconductor is punched to form current paths of meander shape. A plurality of current paths of meander shape are placed on the surface of a support member to which a pair of electrodes A, B are connected through low heat conductive members made of an electric insulating material, and after both ends 1a, 1b are connected to the electrodes A, B respectively, fixing by an insulating plate and an insulating sheet and storage into a metal case are performed to prepare the current lead. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
