| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing and inspecting semiconductors, capable of increasing the number of semiconductor devices to be mounted. SOLUTION: Semiconductor devices 310-380 to be tested are disposed in a cascaded state on a burn-in board. A test signal is input to a cascaded first-stage semiconductor device 310 and sequentially sent to later-stage semiconductor devices via cascading. The test signal is input to the respective semiconductor devices 310-380 at each different delay timing according to a delay time that the respective semiconductor devices 310-380 have. Thus, a risk of exceeding a current limit value of the burn-in board 200 or a burn-in device 500 is eliminated collectively. COPYRIGHT: (C)2011,JPO&INPIT
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