| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate that can be used even in a DC-DC converter, has no defect such as a gap, is easy to be manufactured, and compact in size, and a method for manufacturing the substrate. <P>SOLUTION: Firstly, a circuit material is punched by a press and bent as required into a desired shape. Then circuit materials are joined to one another or arranged as a predetermined position to form a circuit conductor 15. The joining is carried out by, for example, welding. The circuit conductor 15 is put in a metal mold 19. The metal mold 19 is a metal mold for the injection of resin 9, and has a predetermined cavity formed therein. The circuit conductor 15 is fixed to the metal mold 19 with, for example, a pin etc., at a predetermined position. In this state, resin is injected into the metal mold 19, and injected to a circuit conductor surface and between layers, thereby forming the substrate 1. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
