发明名称 METHOD OF FORMING CONDUCTOR PATTERN, WIRING BOARD, AND LIQUID DROPLET EJECTING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern in which the conductor pattern with high reliability can be formed by preventing cracking, breaking of a wire, or the like, to provide a wiring board, and to provide a liquid droplet ejecting device. <P>SOLUTION: The method of forming the conductor pattern includes a conductor pattern precursor forming step of discharging liquid droplets of ink for conductor pattern formation onto a base by a liquid droplet ejecting method and drying them to form a precursor of the conductor pattern which has a pad and a wiring portion connected to the pad on the base, and a burning step of burning the precursor to form the conductor pattern. In the conductor pattern precursor forming step, the liquid droplets of the ink for conductor pattern formation are discharged such that positions where the liquid droplets of the ink for conductor pattern formation are stuck are in a shape formed by concentrically arranging a plurality annular bodies 85 in a pad formation region, where the pad is formed, on the base. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011146485(A) 申请公布日期 2011.07.28
申请号 JP20100005343 申请日期 2010.01.13
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI;KOBAYASHI TOSHIYUKI;UEHARA NOBORU;HAMA YOSHIKAZU;TANABE KENTARO
分类号 H05K3/10;B05C5/00;B05C13/02;B05D1/26;B05D5/12;C09D11/00;C09D11/52 主分类号 H05K3/10
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