发明名称 ELECTRONIC COMPONENT, AND BASE MATERIAL FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electronic component capable of securing a sufficient stroke amount and a terminal load even in the case a connection terminal is miniaturized, to provide a base material for the electronic component, and to provide a manufacturing method of the base material for the electronic component. SOLUTION: The electronic component includes: the plate-like base material body 2 in which a through hole 2f, and grooves 20a, 20b, 20c, 21a, 21b, 21c communicated with this through hole 2f; a resin molded body 3 which has resin protruded elastic parts 10a, 10b formed integrally with the resin filling parts 14a, 14b, 14c at least in one face of the through hole 2f of this base material body 2, resin filling parts 14a, 14b, 14c filled into the grooves 20a, 20b, 20c, 21a, 21b, 21c, and the base material body 2, and in which resin of both ends of the through hole 2f forms mutual retention; and a connection terminal 40 mounted on the base material body 2 so that a part contacted with other electronic components is positioned at the apex of the protruded elastic parts 10a, 10b. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011146350(A) 申请公布日期 2011.07.28
申请号 JP20100008358 申请日期 2010.01.18
申请人 FUJIKURA LTD 发明人 ISHII YUTAKA;OUCHI YASUHIRO
分类号 H01R33/74;B29C45/14;B29C45/26;B29L31/36;H01R13/24;H01R43/00;H01R43/24 主分类号 H01R33/74
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