| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module which has high heat dissipation and high rigidity, prevents damages such as cracks on a solder layer or a semiconductor element due to warpage and deformation due to a difference in thermal expansion by efficiently preventing them, and thus has high durability. <P>SOLUTION: The power module is such that a circuit unit 4 comprising at least a substrate 2 and a semiconductor element 1 is placed and fixed on one surface side of a first cooler 11 and a sealing resin 7 for sealing the circuit unit 4 is formed on the one side surface. In the power module, a second cooler 12 is arranged on the side of the circuit unit 4 and thermally communicates with the one side surface of the first cooler 11. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
