发明名称 METHOD OF ASSEMBLING ELECTRONIC APPARATUS SUBSTRATE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To easily perform the assembly work of an on-site instrument. SOLUTION: An electronic circuit part 1 and a terminal part 2 are mounted on the front and back surfaces of an attaching substrate 14 respectively and they are electrically connected by an electric wire 5. Further, the electronic circuit part 1 and the terminal part 2 are fixed to the attaching substrate 14 by a sealing material 6 and an insertion hole 17 to which the electric wire 5 is inserted is sealed as well to form a substrate assembly 11. Then, the substrate assembly 11 is pressed to a partition 3A inside a casing 3 through a sealing member 12 and fixed by a fixing means 13 to seal a hole part 4 of the partition 3A airtightly. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011146436(A) 申请公布日期 2011.07.28
申请号 JP20100004184 申请日期 2010.01.12
申请人 YAMATAKE CORP 发明人 ISHIKUMA TORU;SAWADA HIDEO;KAJIURA KOICHI;TOMONARI NORIO;HAYASHI TOMOHITO
分类号 H05K5/06;G01D11/24 主分类号 H05K5/06
代理机构 代理人
主权项
地址