| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element chip, a light emitting element package, and a lighting system. <P>SOLUTION: The light emitting element chip includes: a light emitting structure including a first conductivity semiconductor layer, a second conductivity semiconductor layer, and an active layer interposed between the first conductivity and second conductivity semiconductor layers; a transmitting layer on the light emitting structure; and a luminescence material layer on the transmitting layer. Here, the luminescence material layer includes a pattern which does not expose the transmitting layer, partially exposes the transmitting layer or partially exposes the transmitting layer and the light emitting structure. <P>COPYRIGHT: (C)2011,JPO&INPIT |
