| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition used for sealing a gap between a semiconductor element and a substrate in a flip chip type semiconductor device, the composition achieving lower linear thermal expansion of a cured product without increasing a compounding amount of an inorganic filler. SOLUTION: The liquid resin composition for a semiconductor contains (A) an epoxy resin, (B) an epoxy resin curing agent and (C) an inorganic filler, wherein (C) the inorganic filler has an average specific surface area of 500 m<SP>2</SP>/g or more and less than 1,500 m<SP>2</SP>/g and an average pore volume of 0.3 cm<SP>3</SP>/g or more and less than 1.2 cm<SP>3</SP>/g. COPYRIGHT: (C)2011,JPO&INPIT
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