SEMICONDUCTOR MODULE MANUFACTURING METHOD

摘要

Disclosed is a CSP type semiconductor module manufacturing method which increases the production efficiency of semiconductor modules. The semiconductor module manufacturing method involves: a step for attaching to a first insulting resin layer (20) a semiconductor wafer (1) on which multiple semiconductor elements (10) having element electrodes (12) are formed; a step for cutting and separating the semiconductor wafer (1) into the multiple semiconductor elements (10); a step for biaxially stretching and extending the first insulating resin layer (20) and increasing the space between neighboring semiconductor elements (10); a step for fixing the multiple semiconductor elements (10) to a flat board with an interposed second insulating resin layer and removing the first insulating resin layer (20); a step in which the multiple semiconductor elements (10), a third insulating resin layer and a copper plate are laminated in that order to form a laminate having electrodes for electrically connecting the element electrodes (12) and the copper plate; and a step for selectively removing the copper plate to form a wiring layer and forming multiple semiconductor modules; and a step for separating the semiconductor modules.