| 发明名称 |
LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER |
| 摘要 |
A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable. |
| 申请公布号 |
EP2348551(A2) |
申请公布日期 |
2011.07.27 |
| 申请号 |
EP20090818024 |
申请日期 |
2009.10.01 |
| 申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
KWAK, CHANG-HOON;PARK, IL-WOO;SOHN, JOHN RAK;LEE, HYO-JIN;PARK, NA-NA;JOO, SEONG-AH |
| 分类号 |
H01L33/56 |
主分类号 |
H01L33/56 |
| 代理机构 |
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