Fabrication of a MEMS device having moving parts of different thicknesses.

摘要

The method involves machining a front face of a monocrystalline silicon substrate (2) to define side contours i.e. portions of suspended zone (9), according to thickness less than that of the substrate. A barrier layer for etching the zone is formed between the zone and a rear face of substrate. A sacrificial layer selective to etching relative to material of the substrate is formed on the front face. The rear face is machined until identifying certain areas of the sacrificial layer to form another suspended zone and/or to reach the barrier layer. The suspended zones are released.