Assembly with at least one semiconductor module and a transport package

摘要

The arrangement (1,1') has a transport packaging (2) which comprises a cover layer (10), an intermediate layer (20) with a recess (230), and a cover foil. The cover layer is formed with a main surface (100) in laminar manner, where the main surface faces a power semiconductor module (5). The cover foil covers a portion of the power semiconductor module. The cover foil is connected with a main surface (200) of the intermediate layer.