发明名称 Epoxy resin adhesives
摘要 <p>An epoxy resin composition comprises (1) a glycidyl polyether of a dihydric phenol having a viscosity of 5,000-20,000 cps. at 25 DEG C., a molecular weight of about 350-450, an epoxide equivalent of 175-225 and containing on the average 1-1,5 divalent aromatic radicals per molecule, (2) an equimolar condensation product of (1) with a glycol which may be prepared by reacting them together in an epoxy/hydroxy ratio of 1/0,5-2 , the product having a molecular weight of about 385-485, (3) pyromelliticdianhydride, and (4) a dicarboxylic acid anhydride, the weight ratio of (1) to (2) being between 12/88 and 20/80 . Components specified are:-(1) epichlorhydrin reaction products of bisphenol A, resorcinol, 1, 1-bis(4-hydroxy phenyl)-ethane, -propane, -butane, and -2- methyl propane, and 2, 2-bis(4-hydroxyphenyl) propane; (2) reaction products of (1) with ethyleneglycol; (4) phthalic, maleic, succinic, dodecenylsuccinic, and hexahydrophthalic. Amine accelerators which may be added include a -methyl-benzyl dimethylamine, n-butylamine, pyridine and N-methyl pyridine. Fillers specified are Al, Fe, Cu, Al2O3, SiO2, mica and asbestos. Two examples are given. Use. Bonding metals, e.g. steel rods.</p>
申请公布号 GB864437(A) 申请公布日期 1961.04.06
申请号 GB19590019186 申请日期 1959.06.04
申请人 W. R. GRACE & CO. 发明人
分类号 C08G59/18;C08G59/42 主分类号 C08G59/18
代理机构 代理人
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