发明名称 |
Method and apparatus for making semiconductor packages |
摘要 |
A method of packaging a plurality of semiconductor chips comprises: providing a substrate panel having a first coefficient of thermal expansion (CTE); providing a carrier having a second CTE that is less than the first CTE; heating the substrate panel and the carrier to first and second elevated temperatures respectively; mounting the substrate panel at about the first elevated temperature to the carrier, the carrier being at said second elevated temperature, to provide a connection between the carrier and the substrate panel; and cooling the carrier and the substrate panel from the first and second elevated temperatures thereby putting the substrate panel into tension in at least one direction. A stiffener panel may be affixed to the substrate panel and heated to an elevated temperature and while the substrate panel is heated to an elevated temperature. A plurality of dies may be mounted and electrically connected to the substrate panel. Under-filling of the plurality of dies may occur with the stiffener panel affixed to the substrate panel.
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申请公布号 |
US7985621(B2) |
申请公布日期 |
2011.07.26 |
申请号 |
US20060469256 |
申请日期 |
2006.08.31 |
申请人 |
ATI TECHNOLOGIES ULC |
发明人 |
CHAN VINCENT K.;MCLELLAN NEIL;TOPACIO RODEN |
分类号 |
H01L21/00;H01L23/34;H01L23/40;H01L23/48;H01L23/52 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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