发明名称 Semiconductor device with STI and method for manufacturing the semiconductor device
摘要 A semiconductor device includes: a semiconductor substrate having first and second areas; an STI isolation region being made of an isolation trench formed in the semiconductor substrate and an insulating film burying the isolation trench and defining a plurality of active regions in the first and second areas; a first structure formed on an area from the active region in the first area to a nearby STI isolation region and having a first height; and a second structure formed on an area from the active region in the second area to a nearby STI isolation region and having a second height, wherein the surface of the said STI isolation region in the first area is lower than the surface of said STI isolation region in the second area.
申请公布号 US7986015(B2) 申请公布日期 2011.07.26
申请号 US20080343831 申请日期 2008.12.24
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 EMA TAIJI;MIZUTANI KAZUHIRO
分类号 H01L25/065 主分类号 H01L25/065
代理机构 代理人
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