| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve successive bonding of hundreds of thousands of times with a super-thin ball bonding wire of ≤20 μm in diameter. <P>SOLUTION: An alloy matrix containing 5 to 2 mass% of one or more of Pd, Pt and Cu having purities of ≥3N in gold having a purity of ≥5N contains, as fine-amount additive elements, 5 to 5 ppm by mass of Ca, Mg and La respectively or further 1 to 20 ppm of Be and/or 1 to 30 ppm by mass of one or more kinds among Ce, Y and Eu in total, the total amount of the fine-amount additive elements being ≤100 ppm. Consequently, surface segregation of the additive elements on a molten ball surface is suppressed to suppress an increase in slide resistance of a wire during loop formation due to deposition of precipitates and oxides thereof on capillary tips during bonding. Surface properties of those capillary tips are maintained in smooth states to suppress bonding defects such as neck damage and non-sticking in the wire bonding, thereby performing long-period successive bonding. <P>COPYRIGHT: (C)2011,JPO&INPIT |
