| 摘要 |
Provided is a semiconductor package. The semiconductor package may include a base substrate having a substrate part and at least one support part. The substrate part may include a first surface on which at least one first connection terminal is disposed and a second surface opposite to the first surface. The at least one support part may be on the first surface and may have an area smaller than that of the first surface. The semiconductor package may further include at least one first semiconductor chip on the at least one support part and at least one second semiconductor chip on the first surface under the at least one first semiconductor chip. The at least one second semiconductor chip may have a top surface and two side surfaces, the top surface being at an elevation lower than a top surface of the at least one support part and the two side surfaces may be arranged to face the at least one support part.
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