SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce the twist of a semiconductor package by including a support unit which functions as a support of a first semiconductor chip. CONSTITUTION: A substrate unit(1) includes a first surface(1a) and a second surface(1b). A substrate(20) is arranged on the first surface and includes a support(9). At least one semiconductor chip(31-38) is laminated on the support. At least one second semiconductor chip(60) is arranged on the first surface of the first semiconductor chip.