发明名称 METHOD OF BONDING DIFFERENT MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method of bonding different materials which can tightly bind different materials together and, further, does not require to change structures of parts of the different materials. SOLUTION: A method of bonding a metal material and a material different from the metal material together includes the steps of: forming a coated film by subjecting the metal material to surface treatment; applying a pressure-sensitive adhesive material onto the coated film; and performing injection molding of a plastic material to the surface having the coated film on the metal material and maintaining such a state as to be in the temperature range of 150 to 200&deg;C and the pressure range of 32&times;10<SP>6</SP>to 47&times;10<SP>6</SP>Pa. It is preferable that a step of heating the pressure-sensitive adhesive material is further provided after the step of applying the pressure-sensitive adhesive material onto the coated film, and it is recommended to heat the pressure-sensitive adhesive material for 30 to 40 min at 60&deg;C in the heating step. COPYRIGHT: (C)2011,JPO&amp;INPIT
申请公布号 JP2011140648(A) 申请公布日期 2011.07.21
申请号 JP20100287809 申请日期 2010.12.24
申请人 KAEDAR ELECTRONICS (KUNSHAN) CO LTD;UNIHAN CORP 发明人 HUANG LEWEN;REN YONG-JUN
分类号 C09J201/00;C09J5/06 主分类号 C09J201/00
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