| 摘要 |
<p>A dimple key cutting machine having a first mode for cutting double dimple keys and a second mode for cutting single dimple keys, comprising: a location probe, exposed in the first mode and arranged to mechanically determine dimple locations, and withdrawn in the second mode; and an inner dimple depth probe, arranged in the first mode to mechanically determine inner dimple depths by contacting depth limiting tabs held by a fastener in a housing of an inner dimple depth limiter, and arranged in the second mode to mechanically determine both locations and depths of single dimples in a sample key held by a bracket held by the fastener in the housing of the inner dimple depth limiter, the bracket replacing the depth limiting tabs, wherein the inner dimple depth probe is sharpened such as to fit into the single dimples of the sample key</p> |
