SEMICONDUCTOR LIGHT EMITTING DIOD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor light emitting device and a manufacturing method thereof are provided to bend the boundary surface between a second electrode exposure area and a semiconductor laminate, thereby preventing lowering of the leakage feature of a light emitting device. CONSTITUTION: A semiconductor laminate comprises first and the second major surfaces which face each other. The semiconductor laminate includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A connecting fixture is connected from the second major surface to one side of the first conductive semiconductor layer. A first electrode layer is connected to one side of the first conductive semiconductor layer through the connection fixture. A second electrode layer is formed on the second major surface of the semiconductor laminate.