| 摘要 |
PURPOSE: A method and device for testing a semiconductor chip and a device and method for classifying a semiconductor using the same are provided to improve yield by excluding a semiconductor chip of a fault by performing a test about a semiconductor chip which is divided from a wiper. CONSTITUTION: A rotation plate(610) rotates with a rotary unit. A plurality of chip seating modules is installed in the rotation plate in a regular interval. According to rotation of the rotation plate, a plurality of chip seating modules is transferred to a chip loading location and a semiconductor chip cut from the semiconductor substrate is settled. A first test module(630) tests electrical characteristics of the semiconductor chip settled in the chip seating module. A second test module(640) tests optical characteristics of thee semiconductor chip settled to the second test location in the provided chip seating module. |
