| 摘要 |
<p>#CMT# #/CMT# The sink has a mounting surface for a component e.g. semiconductor component, which is to be cooled. A micro cooling structure (3) is connected with inlet and outlet openings (5, 6) by connection channels (4), where a cooling agent is discharged into the structure via the openings. The sink has a monolithic structure and is made of a corrosion resistant high grade steel. #CMT# : #/CMT# Independent claims are also included for the following: (A) a diode laser stack comprising a micro heat sink and a diode laser component (B) a method for manufacturing a micro heat sink. #CMT#USE : #/CMT# Used for cooling a semiconductor component e.g. diode laser in a diode laser component that is utilized in a diode laser stack (Claimed). #CMT#ADVANTAGE : #/CMT# The heat sink has the monolithic structure, thus reducing the external wall thickness of the heat sink to 100 pm, and hence providing a covering between an area in which cooling agent flows and the other area in which the electronic units are up soldered. The wall thickness reduction enables to reduce temperature gradient in the up soldered electronic units. The heat sink is made of the corrosion resistant high grade steel, thus reducing the danger of corrosion and hence preventing leakage of the heat sink. The sink has improved cooling efficiency. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a micro heat unit. 1 : Mounting surface 3 : Micro cooling structure 4 : Connection channels 5 : Inlet opening 6 : Outlet opening.</p> |
