| 摘要 |
<p>The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises;—providing an electronic component (10) having a first pattern with a substantially closed configuration;—providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface;—providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad;—disposing solder material at the solder pad;—positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover;—reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).</p> |
