发明名称 METHOD FOR BONDING FILM BASE MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for producing a bag-shaped package by bonding films made of different kinds of materials to each other, in which firm bonding is achieved without using a laminate resin and exudation of a foreign matter or a residual solvent or the like does not occur, the method being excellent in weather resistance. <P>SOLUTION: In the method for producing a bag-shaped package by bonding films made of different kinds of materials to each other, a pair of film base materials 1, 2 made of different kinds of materials are prepared. At least a part to be bonded of one film base material 1 is irradiated with electron beams 4 and only a part irradiated with electron beams 4 is bonded to the other film base material 2 to form a bag shape. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011136492(A) 申请公布日期 2011.07.14
申请号 JP20090298261 申请日期 2009.12.28
申请人 DAINIPPON PRINTING CO LTD 发明人 UEKI TAKAYUKI;YAGI IZUMI;SHIINA TOKUYUKI
分类号 B29C65/00;B29C65/14;B65D65/40 主分类号 B29C65/00
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