| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric wafer and piezoelectric device in which, even when a piezoelectric substrate is formed by etching the piezoelectric wafer, a shape of the piezoelectric substrate is maintained and the piezoelectric substrate can be easily folded away from a piezoelectric wafer body. <P>SOLUTION: In a piezoelectric wafer 10, a piezoelectric substrate 20, supporting parts 40 and a piezoelectric wafer body 12 are formed by etching. The piezoelectric substrate 20 is connected with the piezoelectric wafer body 12 via a plurality of supporting parts 40. Namely, the supporting parts 40 are connected to an end portion of a face (a proximal end face) 22 provided at a side of a proximal end 26 of the piezoelectric substrate 20. Outer side faces 46 of the supporting parts 40 are then formed continuously along a side face 24 of the piezoelectric substrate 20. Furthermore, on an inner side face 42 of each of the supporting parts 40, a first groove 44 is provided along the proximal end face 22 of the piezoelectric substrate 20. <P>COPYRIGHT: (C)2011,JPO&INPIT |
