发明名称 METHOD AND APPARATUS FOR INSPECTING AND MANAGING ELECTRONIC SUBSTRATE, AND VISUAL INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To repair a substrate on which a defective portion is found without excluding the substrate from an inspection line to eliminate the necessity of a preliminary program for the inspection portion to check it later for appropriate repair. SOLUTION: (a) A defective portion is repaired in at least a part of inspection processes 12A to 12H. (b) When the defect portion is repaired in the step (a), the defect content, position information, and at least one image before and after repair of the defective portion are read. (c) The defect content, the position information, and at least the one image before and after repair read in step (b) are stored in a database 16. (d) The defect content, the position information, and at least one image before and after repair stored in the database 16 in step (c) are timely read. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011138930(A) 申请公布日期 2011.07.14
申请号 JP20090297974 申请日期 2009.12.28
申请人 WIT CO LTD 发明人 UCHIUMI MASATO
分类号 H05K13/08;G01N21/956 主分类号 H05K13/08
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