| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device capable of reducing parts count, lowering manufacturing cost, and greatly enhancing a design flexibility in layout of external terminals. SOLUTION: The electronic component device 1 is constituted in the structure of disposing a metallic frame type shield case 13 within a package body 2 formed of a resin mold having an aperture opening to the upper side, disposing hot side terminals 14, 15 and a ground terminal 16 extended to the external side of the shield case 13 from the internal side thereof 13, embedding the hot side terminals 14, 15 and ground terminal 16 in the resin mold by insert molding together with the shield case 13, connecting the electronic component element disposed within the shield case 13 to the hot side terminals 14, 15 and ground terminal 16, and providing, in continuation to the shield case 13, the shield terminals 13a to 13d for connecting the shield case 13 to the ground potential separately from the ground terminal 16. COPYRIGHT: (C)2011,JPO&INPIT
|
