发明名称 COMPOSITION AND METHOD FOR IMMERSION LITHOGRAPHY
摘要 <P>PROBLEM TO BE SOLVED: To provide a new photoresist composition that is useful for immersion lithography. <P>SOLUTION: The preferred photoresist composition includes one or more materials that can be substantially non-mixable with a resin component of a resist. The further-preferred photoresist composition includes: (1) an Si substitution; (2) a fluorine substitution; (3) a hyperbranched polymer; and/or (4) polymeric particles. The particularly-preferred photoresists can exhibit the reduced leaching of resist materials into an immersion fluid contacting with the resist layer during immersion lithography processing. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011138165(A) 申请公布日期 2011.07.14
申请号 JP20110072230 申请日期 2011.03.29
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 WANG DEYAN
分类号 G03F7/004;G03F7/039;G03F7/075;H01L21/027 主分类号 G03F7/004
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