发明名称 |
COMPOSITION AND METHOD FOR IMMERSION LITHOGRAPHY |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new photoresist composition that is useful for immersion lithography. <P>SOLUTION: The preferred photoresist composition includes one or more materials that can be substantially non-mixable with a resin component of a resist. The further-preferred photoresist composition includes: (1) an Si substitution; (2) a fluorine substitution; (3) a hyperbranched polymer; and/or (4) polymeric particles. The particularly-preferred photoresists can exhibit the reduced leaching of resist materials into an immersion fluid contacting with the resist layer during immersion lithography processing. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011138165(A) |
申请公布日期 |
2011.07.14 |
申请号 |
JP20110072230 |
申请日期 |
2011.03.29 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS LLC |
发明人 |
WANG DEYAN |
分类号 |
G03F7/004;G03F7/039;G03F7/075;H01L21/027 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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