发明名称 PATTERN FORMING METHOD, PATTERN, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND RESIST FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern forming method by which a pattern excellent in exposure latitude (EL) and line width variance (LWR) or CD (critical dimension) uniformity (CDU) is formed; to provide a pattern formed by the same; to provide a chemically amplified resist composition used in the pattern forming process; and to provide a resist film formed from the resist composition. <P>SOLUTION: The pattern forming method includes (&alpha;) a process for forming a film by using a chemically amplified resist composition containing (A) a resin having a non-aromatic cyclic organic group, (B) a compound generating an acid by the irradiation with an actinic ray or radiation, and (C) a crosslinking agent, (&beta;) a process for exposing the formed film, and (&gamma;) a process for developing the exposed film by using a developing solution containing an organic solvent. A pattern formed by the pattern forming method, a chemically amplified resist composition used in the pattern forming method, and a resist film formed from the resist composition are also provided. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011137888(A) 申请公布日期 2011.07.14
申请号 JP20090296418 申请日期 2009.12.25
申请人 FUJIFILM CORP 发明人 KAMIMURA SATOSHI;TARUYA SHINJI;ENOMOTO YUICHIRO;KATO KEITA;IWATO KAORU
分类号 G03F7/039;C08F220/12;G03F7/004;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址