发明名称 SURFACE ACOUSTIC WAVE DEVICE, OSCILLATOR, AND MODULE APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device having excellent temperature characteristics and a sufficient electromechanical coupling coefficient. <P>SOLUTION: The surface acoustic wave device 1 includes a sapphire substrate 10 having a C-plane as a main surface 11, comb-like electrodes 21, 22 formed in contact with the main surface 11 of the sapphire substrate 10, an aluminum nitride film 30 for covering the comb-like electrodes 21, 22, and a silicon dioxide film 40 formed on the surface of the aluminum nitride film 30. The surface acoustic wave device 1 has the excellent temperature characteristics, the sufficient electromechanical coupling coefficient necessary for oscillation, and a high acoustic velocity by setting the proper range of relation between the standardized film thickness KH-AlN of the aluminum nitride film 30 and the standardized film thickness KH-SiO<SB>2</SB>of the silicon dioxide film 40. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011139214(A) 申请公布日期 2011.07.14
申请号 JP20090297055 申请日期 2009.12.28
申请人 SEIKO EPSON CORP 发明人 KONO HIDEYASU;FUJIOKA SHINJI
分类号 H03H9/145;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H01L41/23;H01L41/29;H01L41/316;H03B5/30;H03H9/25 主分类号 H03H9/145
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