发明名称 EXTERNAL STRUCTURE FOR ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide an external structure which prevents an outer sheet to cover an equipment body from becoming wavy or being uneven when bonding the outer sheet to an object even if the outer sheet is thin in electronic equipment. SOLUTION: The external structure for the electronic equipment is obtained by bonding the outer sheet 7 to a surface of the equipment body. An area to be covered with the outer sheet 7, which has the same outer form as that of the outer sheet 7, is formed on the surface of the equipment body. The outer sheet 7 comprises a center area and an outer periphery area surrounding the center area. Only the center area of the outer sheet 7 is bonded to the area to be covered through a double-coated adhesive tape 8. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011137851(A) 申请公布日期 2011.07.14
申请号 JP20090295772 申请日期 2009.12.25
申请人 SANYO ELECTRIC CO LTD 发明人 NAKAGAWA HIROSHI;KUMITA MINORU
分类号 G03B17/02;H04N5/225 主分类号 G03B17/02
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