发明名称 |
SEMICONDUCTOR APPARATUS WITH LID BONDED ON WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor apparatus includes: a wiring board; a lid; and gap filling resin. A semiconductor chip is mounted on the wiring board. The lid includes inlet portions for injecting resin. The semiconductor chip is covered with the lid on the wiring board. The gap filling resin bonds the wiring board and the lid inside the lid.
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申请公布号 |
US2011169155(A1) |
申请公布日期 |
2011.07.14 |
申请号 |
US201113004444 |
申请日期 |
2011.01.11 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
OGIHARA CHIHO |
分类号 |
H01L23/24 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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