| 摘要 |
PROBLEM TO BE SOLVED: To provide: a wafer-level lens array capable of preventing failure such as distortion of a substrate and a crack of a lens due to temperature in a reflow stage; a lens module; and an imaging unit. SOLUTION: The wafer-level lens array includes the substrate 31 and a plurality of lenses 30 provided on the substrate 31. A plurality of through-holes 32, pierced in a thickness direction of the substrate from a first surface of the substrate 31 to a second surface on an opposite side to the first surface, are formed on the substrate 31. The lens 30 is provided by filling up each of the through-holes 32. When the coefficients of linear expansion of the substrate 31 and the lens 30 are equal, or when the linear expansion coefficient of the substrate 31 is larger than that of the lens 30, a difference between the coefficients of linear expansion of the substrate 31 and the lens 30 is equal to or under 3.0×10<SP>-5</SP>/°C. COPYRIGHT: (C)2011,JPO&INPIT
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