| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a card device that secures a height space for mounting various electronic components. <P>SOLUTION: A semiconductor package section 23 is formed on the side to be bonded to a substrate section 21, and provided with a card-side connector section 3 having card-side terminals for inputting and outputting information signals. The semiconductor package section 23 includes package-side terminals 30 at a location at which the semiconductor package section 23 is bonded to the substrate section 21 by superposition. The substrate section 21 includes substrate-side terminals 32 at a location at which the substrate section 21 is connected to the semiconductor package section 23 by superposition. The substrate section 21 is electrically connected to the semiconductor package section 23 by making use of the package-side terminals 30 and the substrate-side terminals 32. The superposition junction between the semiconductor package section 23 and the substrate section 21 is provided with such an offset that the card-side connector 3 is exposed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
